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SEMICON Japan
SEMICON Japan 2006 logo
December 6-8, 10:00~17:00
Makuhari Messe (Nippon Convention Center)
Yokogawa Booth 9C-804, 3A-105


Thank you for coming to our booth in SEMICON Japan 2006.

At SEMICON Japan 2006, drawing on the concept of Customer Centric Solutions, Yokogawa focued on showcasing actual examples of our solutions provided through the courtesy of both Japanese and international customers. We also exhibited our cutting-edge testing solutions.

Yokogawa is committed to providing solutions for the various challenges customers are now facing both at the management level and production level. With the excellent capabilities covering from individual testers to control and management systems for the entire factory, we are confident that we can provide optimal solutions to each customer.



Appearance of Hall 9 Appearance of lounge at center of booth

Exhibition corner of FPD Driver IC Test Solution

Exhibition corner of Semiconductor Manufacturing Site Total Solutions


PRESENTATIONS

Back-end Booth (Hall 9, Booth No. 9C-804)
  • Semiconductor Manufacturing Site Total Solutions
  • SoC Test Solution
    High Speed Interface Test Solution
    Test Program Quality Confirmation Solution
    RF Wafer & RF-CMOS Test Solution
  • FPD Test Solution
    High-Performance-Running Cost Test Solution
    Next Generation HDMI Driver Test Solution
    Program-Generate Test Solution
    World-First 4DUT Test Solution
  • Memory Test Solution
    High Speed Probing Test Solution
     Back-End Test Solution
  • DRIVE & CONTROL SOLUTION / DD MOTOR & DRIVE SOLUTION
    Better Throughput for Direct Solution
    Open & Network Solution
    Motion & Embedded Solution
    FA-M3R Lineup / e-RT3 Lineup
  • Image Sensor Test Solution
    CMOS Image Sensor Test Solution
    CCD Image Sensor Test Solution
    Image Quality Test Solution for Image Sensors
  • Measuring Solution
    Measuring Solution for Efficiency of Power Source Devices
    Analysis Solution for Malfunctions in Electronic Circuits
    Signal Analysis Solution for High Speed Embedded Systems

Front-end Booth (Hall 3, Booth No. 3A-105)
  • Semiconductor Manufacturing Site Total Solutions
  • Enterprise Resource Planning Solution
  • Manufacturing Execution System Solution
  • Equipment Online Solution
  • Equipment Engineering System Solution
  • Recipe Management Solution
  • Energy & Cost Management Solution Theme

Seminar
  • Theme: Analyzing problems based on wafer tracking and final yield
    December 6, 2006 15:30 -16:20 Seminar Room 1 ( Hall 3 1F )
  • Theme : Energy and cost management
    December 7, 2006 15:30 -16:20 Seminar Room 2 ( Hall 4 1F )


GUIDE TO EXHIBITION HALLS
GLOBAL  
YOKOGAWA

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