2002 Press Releases-04

Tokyo, Japan - February 19, 2002

Yokogawa Releases HBT-Based Modules for 40-Gbit/s Optical Transmission Systems- Achieving LSI Density Levels by Employing a Compound Semiconductor

Yokogawa Electric Corporation announced that it has developed 4-to-1 multiplexer and 1-to-4 demultiplexer modules for optical transmission systems. Both modules are available in two types: a connector type for integration into equipment for measurement and development, and a ceramic package type for commercial communication equipment. The ceramic package type module based on HBT (Hetero-junction Bipolar Transistor), which relies on a compound semiconductor not suitable for high-density designs, is the first Japanese module small enough to be successfully installed on a board. Yokogawa began delivering the connector type module from February 2002. The ceramic package type module released on April 2002.

Overview

By combining the functions of three of the 2-to-1 multiplexer and 1-to-2 demultiplexer modules we launched in September 2001, 10-Gbps signals can be converted into a 40-Gbps output. The new 4-to-1 multiplexer and 1-to-4 demultiplexer modules are smaller than their predecessors but boast the functions of 10 separate modules including 2-to-1 multiplexer and 1-to-2 demultiplexer modules, flip-flop modules that retime waveforms, and others. The ceramic package type module not only offers the functions of 10 modules but also has a volumetric capacity which is only a quarter that of the 2-to-1 multiplexer.

"Practical use of the 40-Gbps optical transmission systems currently being developed, requires signal multiplexer and modulator modules that can operate at 40 Gbps or faster and are small enough to be successfully installed on a board," said Mamoru Sanagi, Senior Vice President of T&M Business Division. "So far, almost no one has been successful in downsizing modules that can work at very high frequency rates because of the highly advanced device technologies it requires. Yokogawa overcame this difficulty and is ready to commercialize the new modules, which were made possible by approximately 20 years of experience in developing compound semiconductor technologies."

Product Features

Size Reduced by Greatly Increasing Packing Density
The ceramic package type is 18×16×4.4 mm in size, and the connector type is 33×31×11 mm (excluding the connector unit). The volumetric capacity of the ceramic package type module is about a quarter and the connector type module is about as twice as that of the 2-to-1 multiplexer module.
Elimination of Timing Adjustment
Conventional modules require timing adjustment to compensate for differences, for example, in wiring length between modules. The new modules eliminate the need for adjustment by incorporating all the modules into a single package that includes waveform-timing and synchronization circuits.
Minimum Output of 43 Gbps
The new modules achieve a minimum output of 43 Gbps in order to support FEC (Forward Error Correction).

About Yokogawa
Yokogawa's global network of 19 manufacturing facilities and 89 companies spans 32 countries. Since its founding in 1915, the US$4 billion company has been engaged in cutting-edge research and innovation, securing more than 7,500 patents and registrations, including the world's first digital sensors for flow and pressure measurement. Industrial automation and control, test and measurement, information systems and industry support are the core businesses of Yokogawa.
For more information about Yokogawa, please visit our web site at www.yokogawa.com.